PillarHall® – accelerating thin film R&D

“What you can’t measure, you can’t improve.”

PillarHall® silicon wafers and chips enable easy analysis of thin film conformality using well-defined, record-demanding microscopic 3-D structures. Typical usage areas are atomic layer deposition and chemical vapor deposition R&D.

PillarHall introduction in SlideShare.

What is your opinion of conformality measurements?
TAKE THE SURVEY and express your interest to test PillarHall.

Scientific articles (newest first) created with PillarHall® microscopic lateral high-aspect-ratio (LHAR) test structures:
1.  Influence of ALD temperature on thin film conformality: Investigation with microscopic lateral high-aspect-ratio structures
R. L. Puurunen, F. Gao, Proceedings of the International Baltic Conference on Atomic Layer Deposition, 2-4 Oct 2016, St. Petersburg, Russia. Electronically published in IEEE Xplore, http://ieeexplore.ieee.org/document/7886526/
2. Nucleation and Conformality of Iridium and Iridium Oxide Thin Films Grown by Atomic Layer Deposition
M. Mattinen, J. Hämäläinen, F. Gao, P. Jalkanen, K. Mizohata, J. Räisänen, R. L. Puurunen, M. Ritala, M. Leskelä, Langmuir 32 (2016) 10559-10569.
http://dx.doi.org/10.1021/acs.langmuir.6b03007
3.  Microscopic silicon-based lateral high-aspect-ratio structures for thin film conformality analysis
F. Gao, S. Arpiainen, R. L. Puurunen, J. Vac. Sci. Technol. A (letter) 33 (2015) 010601 (5 pages).
http://dx.doi.org/10.1116/1.4903941, open access [PDF].
 
CONTACT
Dr. Mikko Utriainen

VTT Technical Research Centre of Finland Ltd

pillarhall (at) vtt.fi

Tel: +358 40 753 7415

Twitter: #TestedWithPillarHall